Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/21/2016
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Application #:
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14038769
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Filing Dt:
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09/27/2013
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Publication #:
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Pub Dt:
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04/17/2014
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Inventors:
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Ming-Chih Chen, Dyi-Chung Hu
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Title:
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PACKAGING CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 38, HSING PONG RD., KWEI-SAN INDUSTRIAL ZONE, |
| TAOYUAN, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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