Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/06/2015
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Application #:
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13835367
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Filing Dt:
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03/15/2013
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Publication #:
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Pub Dt:
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04/17/2014
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Inventors:
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Cheng-Hung Lin, Yu-Yun Lo, Cheng-Yen Chen, Yu-Hung Lai
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Title:
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METHOD OF FORMING LIGHT EMITTING DIODE DIES, LIGHT EMITTING DIODE WAFER AND LIGHT EMITTING DIODE DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.5, DALI 3RD RD., SHANHUA DIST. |
| TAINAN CITY, TAIWAN 741 |
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| STROOCK & STROOCK & LAVAN LLP |
| 180 MAIDEN LANE |
| NEW YORK, NY 10038 |
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Assignment:
2
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ADDRESS CHANGE REGISTRATION FORM
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| NO.31, SECTION 2, HUANDONG ROAD |
| SHANHUA DISTRICT (TAINAN SCIENCE PARK) |
| TAINAN CITY, TAIWAN 741 |
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| PROSYLA GROUP PC |
| 530 TECHNOLOGY DR. |
| SUITE 100 |
| IRVINE, CA 92618 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491 OKA, KAMINAKA-CHO |
| ANAN-SHI |
| TOKUSHIMA, JAPAN 774-8601 |
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| PROSYLA GROUP PC |
| 530 TECHNOLOGY DR. |
| SUITE 100 |
| IRVINE, CA 92618 |
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