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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/08/2015
Application #:
14143663
Filing Dt:
12/30/2013
Publication #:
Pub Dt:
04/24/2014
Inventors:
Xiaolu Song, Lixian Wang, Ninghua Zhu
Title:
Optoelectronic device packaging method and chip assembly having an isolation dielectric located on both sides of a high-frequency transmission line to form a coplanar waveguide transmission line (As amended)
Assignment: 1
Reel/Frame:
036240/0231Recorded: 08/03/2015Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/12/2014
Exec Dt:
08/21/2014
Exec Dt:
08/21/2014
Assignee:
HUAWEI ADMINISTRATION BUILDING
BANTIAN, LONGGANG DISTRICT, GUANGDONG
SHENZHEN, CHINA 518129
Correspondent:
GUSTAVO SILLER, JR.
BRINKS GILSON & LIONE
PO BOX 10395
CHICAGO, IL 60610

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