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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8822267
Issue Dt:
09/02/2014
Application #:
13655036
Filing Dt:
10/18/2012
Publication #:
20140113410
Pub Dt:
04/24/2014
Inventors:
How Yuan Hwang, Yaohuang Huang, Phone Maw Hla, Jay Maghirang, Kim-Yong Goh, Edmond Soon
Title:
SYSTEM IN PACKAGE MANUFACTURING METHOD USING WAFER-TO-WAFER BONDING
Assignment: 1
Reel/Frame:
030252/0619Recorded: 04/19/2013Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HWANG, HOW YUAN
Exec Dt:
09/28/2012
MAGHIRANG, JAY
Exec Dt:
09/27/2012
HUANG, YAOHUANG
Exec Dt:
02/22/2013
GOH, KIM-YONG
Exec Dt:
09/27/2012
HLA, PHONE MAW
Exec Dt:
09/27/2012
SOON, EDMOND
Exec Dt:
09/27/2012
Assignee:
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569508
Correspondent:
KAREN M. HENCKEL
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104
Assignment: 2
Reel/Frame:
060127/0427Recorded: 06/07/2022Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
STMICROELECTRONICS PTE LTD
Exec Dt:
05/31/2022
Assignee:
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39
1228 PLAN-LES-OUATES
GENEVA, SWITZERLAND
Correspondent:
STMICROELECTRONICS, INC.
750 CANYON DRIVE, SUITE 300
COPPELL, TX 75019

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