Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13654425
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Filing Dt:
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10/18/2012
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Publication #:
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Pub Dt:
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04/24/2014
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Inventors:
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Chung-Sung CHANG, Ming-Tse LIN, Chu-Fu LIN, Chun-Hung CHEN, Yung-Chang LIN
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Title:
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WAFER EDGE TRIMMING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3, LI-HSIN RD. II |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| FORESIGHT IP DING YU TAN |
| 14F., NO.111, SONGJIANG RD |
| UNIT B03 |
| TAIPEI, TAIWAN |
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