Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/21/2017
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Application #:
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13976919
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Filing Dt:
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08/28/2013
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Publication #:
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Pub Dt:
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04/24/2014
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PCT #:
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US2013032699
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Inventors:
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Darren S. Jue, Venkatraman Iyer, Sitaraman V. Iyer
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Title:
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HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD |
| SANTA CLARA, CALIFORNIA 95054 |
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| PATENT CAPITAL GROUP |
| C/O CPA GLOBAL |
| PO BOX 52050 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
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| INTEL CORPORATION |
| C/O CPA GLOBAL |
| PO BOX 52050 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
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| PATENT CAPITAL GROUP |
| C/O CPA GLOBAL |
| P.O. BOX 52050 |
| MINNEAPOLIS, MN 55402 |
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