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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13729759
Filing Dt:
12/28/2012
Publication #:
Pub Dt:
05/01/2014
Inventors:
Chen-Han Lin, Kuo-Hsiang Li, Jung-Pang Huang, Nan-Jia Huang, Hsin-Yi Liao
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Assignment: 1
Reel/Frame:
029541/0075Recorded: 12/28/2012Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/23/2012
Exec Dt:
08/23/2012
Exec Dt:
08/23/2012
Exec Dt:
08/23/2012
Exec Dt:
08/23/2012
Assignee:
NO. 123, SEC. 3, DA FONG ROAD, TANTZU
TAICHUNG, TAIWAN
Correspondent:
EDWARDS WILDMAN PALMER LLP
P.O. BOX 55874
BOSTON, MA 02205

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