Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/27/2014
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Application #:
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13667458
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Filing Dt:
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11/02/2012
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Publication #:
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Pub Dt:
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05/08/2014
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Inventors:
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Roland Gooch, Buu Diep, Thomas Allan Kocian, Stephen H. Black, Adam M. Kennedy
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Title:
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INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 870 WINTER STREET |
| WALTHAM, MASSACHUSETTS 02451 |
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| CANTOR COLBURN LLP - RAYTHEON |
| 20 CHURCH STREET |
| 22ND FLOOR |
| HARTFORD, CT 06103 |
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