Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14116979
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Filing Dt:
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12/18/2013
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Publication #:
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Pub Dt:
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05/08/2014
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Inventors:
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Mitsuyoshi Hamada, Fumio Furusawa, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba
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Title:
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EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-6606 |
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| STITES & HARBISON PLLC |
| 1199 NORTH FAIRFAX STREET |
| SUITE 900 |
| ALEXANDRIA, VA 22314 |
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