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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
10/27/2015
Application #:
14027014
Filing Dt:
09/13/2013
Publication #:
Pub Dt:
05/15/2014
Inventors:
Masataka SHIRAMIZU, Ming Shang
Title:
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
031224/0563Recorded: 09/17/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/24/2013
Exec Dt:
07/24/2013
Assignee:
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-8310
Correspondent:
STUDEBAKER BRACKETT PC
12700 SUNRISE VALLEY DRIVE
SUITE 102
RESTON, VA 20191
Assignment: 2
Reel/Frame:
031867/0052Recorded: 12/19/2013Pages: 8
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND INVENTOR'S NAME PREVIOUSLY RECORDED ON REEL 031224 FRAME 0563. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
07/24/2013
Exec Dt:
07/24/2013
Assignee:
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-8310
Correspondent:
STUDEBAKER BRACKETT PC
12700 SUNRISE VALLEY DRIVE
SUITE 102
RESTON, VA 20191
Assignment: 3
Reel/Frame:
052042/0651Recorded: 03/06/2020Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/13/2020
Assignee:
4-5 BURTON HALL ROAD
SANDYFORD
DUBLIN, IRELAND 18
Correspondent:
SHAMI MESSINGER PLLC
1000 WISCONSIN AVE NW
SUITE 200
WASHINGTON, DC 20007

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