Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/29/2014
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Application #:
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13674096
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Filing Dt:
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11/12/2012
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Publication #:
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Pub Dt:
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05/15/2014
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Inventors:
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Pui Chung Simon LAW, Bin XIE, Dan YANG
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Title:
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THROUGH-SILICON VIA STRUCTURE WITH PATTERNED SURFACE, PATTERNED SIDEWALL AND LOCAL ISOLATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3/F, BUILDING 6, 2 SCIENCE PARK WEST AVENUE |
| HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, HONG KONG |
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| ELLA CHEONG HONG KONG |
| 5001 HOPEWELL CENTRE |
| 183 QUEEN'S ROAD EAST, WAN CHAI |
| HONG KONG, HONG KONG |
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