Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/22/2016
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Application #:
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14170455
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Filing Dt:
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01/31/2014
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Publication #:
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Pub Dt:
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05/22/2014
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Inventors:
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Ping-Yin Liu, Li-Chen Chu, Hung-Hua LIn, H. T. Huang, Jung-Huei Peng, Yuan-Chih Hsieh et al
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Title:
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WAFER LEVEL PACKAGING BOND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| HAYNES AND BOONE, LLP IP SECTION |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
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