Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/08/2015
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Application #:
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14066212
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Filing Dt:
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10/29/2013
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Publication #:
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Pub Dt:
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05/22/2014
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Inventors:
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Hideki AKIBA, Toshio SHIOBARA, Susumu SEKIGUCHI, Tomoaki NAKAMURA
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Title:
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ENCAPSULANT , ENCAPSULATED SUBSTRATE HAVING SEMICONDUCTOR DEVICES MOUNTING THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMING THEREON, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-1, OHTEMACHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| AARON L. WEBB |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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