Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14123140
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Filing Dt:
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01/31/2014
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Publication #:
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Pub Dt:
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06/05/2014
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Inventors:
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Daisuke Fujimoto, Kunpei Yamada, Nobuyuki Ogawa, Hikari Murai
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Title:
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PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-6606 |
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| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| 1300 NORTH SEVENTEENTH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209-3873 |
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