Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13693109
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Filing Dt:
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12/04/2012
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Publication #:
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Pub Dt:
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06/05/2014
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Inventors:
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Thorsten Meyer, Markus Brunnbauer, Bernd Waidhas
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Title:
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CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 10-12 |
| NEUBIBERG, GERMANY 85579 |
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| VIERING, JENTSCHURA & PARTNER |
| 3770 HIGHLAND AVE. SUITE 203 |
| MANHATTAN BEACH, CA 90266 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE ON THE COVER SHEET WHICH SHOULD READ: INTEL MOBILE COMMUNICATIONS GMBH PREVIOUSLY RECORDED ON REEL 029441 FRAME 0129. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT ON PAGE 2 AND 3.
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| AM CAMPEON 10-12 |
| NEUBIBERG, GERMANY 85579 |
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| VIERING, JENTSCHURA & PARTNER |
| 3770 HIGHLAND AVE. SUITE 203 |
| MANHATTAN BEACH, CA 90266 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| ANGELA MILLER |
| C/O CLARIVATE |
| P.O. BOX 5427 |
| TUCSON, AZ 85703 |
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