Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/12/2019
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Application #:
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13691587
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Filing Dt:
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11/30/2012
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Publication #:
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Pub Dt:
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06/05/2014
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Inventor:
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Ralf Otremba
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Title:
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Packaged Semiconductor Device with Tensile Stress and Method of Making a Packaged Semiconductor Device with Tensile Stress
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AM CAMPEON 1-12 |
NEUBIBERG, GERMANY 85579 |
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SLATER & MATSIL, L.L.P. |
17950 PRESTON RD. |
SUITE 1000 |
DALLAS, TX 75252 |
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