Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/10/2016
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Application #:
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14174214
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Filing Dt:
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02/06/2014
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Publication #:
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Pub Dt:
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06/05/2014
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Inventors:
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Richard Chu, Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin, Lan-Lin Chao et al
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Title:
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HERMETIC WAFER LEVEL PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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HAYNES AND BOONE, LLP IP SECTION |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
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05/10/2024 10:32 AM
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