Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13708370
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Filing Dt:
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12/07/2012
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Publication #:
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Pub Dt:
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06/12/2014
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Inventors:
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Yusuke TANAHASHI, Tetsuaki SUZUKI, Nobuaki ISHIZAKA
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Title:
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THERMOSETTING RESIN COMPOSITIONS, RESIN FILMS IN B-STAGE, METAL FOILS, COPPER CLAD BOARDS AND MULTI LAYER BUILD-UP BOARDS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-19-43, HIGASHI-OIZUMI, |
| NERIMA-KU, TOKYO, 178-8511, JAPAN |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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