Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13950205
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Filing Dt:
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07/24/2013
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Publication #:
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Pub Dt:
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06/19/2014
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Inventors:
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Do Jae Yoo, Tae Hyun Kim, Kwang Soo Kim, Joon Seok Chae
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Title:
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POWER MODULE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314, MAETAN 3-DONG, YEONGTONG-GU, SUWON |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| LADAS & PARRY |
| 5670 WILSHIRE BOULEVARD, SUITE 2100 |
| LOS ANGELES, CA 90036-5679 |
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