Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/02/2017
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Application #:
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13726251
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Filing Dt:
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12/24/2012
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Publication #:
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Pub Dt:
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06/26/2014
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Inventors:
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Matsuko Saito, Makoto Sakai, Shinjiro Hayashi
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Title:
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COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TENNOZ CENTRAL TOWER 2-2-24 HIGASHI SHINAGAWA |
| SHINAGAWA-KU |
| TOKYO, JAPAN 102-0075 |
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| KRISTIE ELLISON |
| 2040 DOW CENTER |
| MIDLAND, MI 48674 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 455 FOREST STREET |
| MARLBOROUGH, MASSACHUSETTS 01752 |
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| KRISTIE ELLISON |
| 2040 DOW CENTER |
| MIDLAND, MI 48674 |
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