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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/31/2015
Application #:
13724426
Filing Dt:
12/21/2012
Publication #:
Pub Dt:
06/26/2014
Inventors:
Helmut Hagleitner, Fabian Radulescu
Title:
DIELECTRIC SOLDER BARRIER FOR SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
029519/0529Recorded: 12/21/2012Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/20/2012
Exec Dt:
12/20/2012
Assignee:
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27703
Correspondent:
WITHROW & TERRANOVA, P.L.L.C.
100 REGENCY FOREST DRIVE
SUITE 160
CARY, NC 27518
Assignment: 2
Reel/Frame:
064185/0755Recorded: 06/30/2023Pages: 69
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/23/2023
Assignee:
214 N. TRYON STREET, 27TH FLOOR
MAIL CODE CN-NC-H27A
CHARLOTTE, NORTH CAROLINA 28202
Correspondent:
NIKOLAI DOKKEDAHL
1285 AVENUE OF THE AMERICAS
PAUL WEISS RIFKIND WHARTON &GARRISON LLP
NEW YORK, NY 10019-6064

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