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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
06/12/2018
Application #:
13733668
Filing Dt:
01/03/2013
Publication #:
Pub Dt:
07/03/2014
Inventors:
Sanjay Misra, John Timmerman, Kasyap Seethamraju
Title:
THERMALLY CONDUCTIVE EMI SUPPRESSION COMPOSITIONS
Assignment: 1
Reel/Frame:
029563/0142Recorded: 01/03/2013Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/02/2013
Exec Dt:
12/19/2012
Exec Dt:
01/03/2013
Assignee:
18930 WEST 78TH STREET
CHANHASSEN, MINNESOTA 55317
Correspondent:
HAUGEN LAW FIRM
SUITE 1130 - TCF TOWER
121 SOUTH EIGHTH STREET
MINNEAPOLIS, MN 55402
Assignment: 2
Reel/Frame:
035779/0071Recorded: 06/03/2015Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/25/2015
Assignee:
HENKELSTRASSE 67
DUSSELDORF, GERMANY 40589
Correspondent:
HAUGEN LAW FIRM PLLP
121 SOUTH EIGHTH STREET
1130 TCF TOWER
MINNEAPOLIS, MN 55402
Assignment: 3
Reel/Frame:
059357/0267Recorded: 03/09/2022Pages: 26
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/18/2022
Assignee:
HENKELSTRASSE 67
DUESSELDORF, GERMANY 40589
Correspondent:
HENKEL CORPORATION
ONE HENKEL WAY
ROCKY HILL, CT 06067

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