Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/26/2020
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Application #:
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14082339
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Filing Dt:
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11/18/2013
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Publication #:
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Pub Dt:
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07/03/2014
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Inventors:
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Yong Cheol CHU, Hyun Kyu LEE, Jung Ug KWAK, Seung Jin LEE, Sang Ho JEON, Yong Sik CHOI
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Title:
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METAL CORE SOLDER BALL AND HEAT DISSIPATION STRUCTURE FOR SEMICONDUCTOR DEVICE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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597-3 YEONAM-DONG, BUK-GU, 683-804, REPUBLIC OF KOREA |
ULSAN, KOREA, REPUBLIC OF |
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NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
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