Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/21/2015
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Application #:
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13732664
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Filing Dt:
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01/02/2013
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Publication #:
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Pub Dt:
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07/03/2014
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Inventors:
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Arkadii V. Samoilov, Peter R. Harper, Viren Khandekar, Pirooz Parvarandeh
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Title:
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MULTI-DIE, HIGH CURRENT WAFER LEVEL PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 160 RIO ROBLES |
| SAN JOSE, CALIFORNIA 95134 |
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| ADVENT IP/MAXIM |
| 2425 SOUTH 144TH STREET, SUITE 202 |
| OMAHA, NE 68144 |
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