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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/17/2015
Application #:
14087784
Filing Dt:
11/22/2013
Publication #:
Pub Dt:
07/03/2014
Inventors:
Takayuki Nomura, Yoshiki Ikeda, Osamu Mizoguchi, Hitoshi Tsujikawa
Title:
MOLDING METHOD AND MOLD THEREFOR
Assignment: 1
Reel/Frame:
031661/0113Recorded: 11/22/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/27/2011
Exec Dt:
04/27/2011
Exec Dt:
04/27/2011
Exec Dt:
04/27/2011
Assignee:
2-40, OHSU 4-CHOME
NAKA-KU
NAGOYA-SHI, JAPAN 460-0011
Correspondent:
J-TEK LAW PLLC
601 PENNSYLVANIA AVENUE, NW
SUITE 900, SOUTH BUILDING
WASHINGTON, DC 20004

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