Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/23/2015
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Application #:
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14238097
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Filing Dt:
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02/10/2014
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Publication #:
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Pub Dt:
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07/10/2014
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Inventors:
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Yoshirou Kuromitsu, Yoshiyuki Nagatomo, Nobuyuki Terasaki, Toshio Sakamoto et al
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Title:
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POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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| EDWARDS WILDMAN PALMER LLP |
| P.O BOX 55874 |
| BOSTON, MA 02205 |
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