Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/29/2016
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Application #:
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13920468
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Filing Dt:
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06/18/2013
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Publication #:
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Pub Dt:
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07/17/2014
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Inventor:
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Shih-Chi CHEN
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Title:
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DIE PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F., NO.9, LI HSIN RD., HSINCHU SCIENCE PARK, |
| HSINCHU CITY, TAIWAN 30078 |
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| MUNCY, GEISSLER, OLDS & LOWE, PLLC |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F., NO. 1, LN. 25, XIANZHENG 8TH ST., |
| ZHUBEI CITY, HSINCHU COUNTY, TAIWAN 302 |
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| JOE MCKINNEY MUNCY |
| 4000 LEGATO ROAD, SUITE 310 |
| FAIRFAX, VA 22033 |
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