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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/21/2014
Application #:
14156687
Filing Dt:
01/16/2014
Publication #:
Pub Dt:
07/17/2014
Inventors:
Rong Yeu CHANG, Chia Hsiang HSU, Chuan Wei CHANG, Hsien Sen CHIU, Chao Tsai HUANG
Title:
Computer-Implemented Simulation Method and Non-Transitory Computer Medium for Use in Molding Process, and Molding System Using the Same
Assignment: 1
Reel/Frame:
031983/0580Recorded: 01/16/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/25/2013
Exec Dt:
11/22/2013
Exec Dt:
11/25/2013
Exec Dt:
11/22/2013
Exec Dt:
11/22/2013
Assignee:
TAI YUEN HI-TECH INDUSTRIAL PARK 8F-2, NO.32, TAIYUAN ST., CHUPEI CITY
HSINCHU COUNTY, TAIWAN 30265
Correspondent:
SINORICA, LLC
19785 CRYSTAL ROCK DRIVE
SUITE 207
GERMANTOWN, MD 20874

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