Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/07/2015
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Application #:
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13754513
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Filing Dt:
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01/30/2013
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Publication #:
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Pub Dt:
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07/31/2014
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Inventors:
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Jonathan Almeria Noquil, Osvaldo Jorge Lopez, Juan Herbsommer
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Title:
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AN INTEGRATED CIRCUIT ("IC") ASSEMBLY INCLUDES AN IC DIE WITH A TOP METALLIZATION LAYER AND A CONDUCTIVE EPOXY LAYER APPLIED TO THE TOP METALLIZATION LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MS 3999 |
| 12500 TI BOULEVARD |
| DALLAS, TEXAS 75243 |
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| TEXAS INSTRUMENTS INCORPORATED |
| MS 3999 |
| P.O. BOX 655474 |
| DALLAS, TEXAS 75265 |
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