Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14342352
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Filing Dt:
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04/28/2014
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Publication #:
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Pub Dt:
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08/14/2014
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Inventors:
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Lee Cheung Lau, Jintu Fan, Albert Pui Sang Lau, Manas Kumar Sarkar
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Title:
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THERMAL INSULATION STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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105-113, TA CHUEN PING STREET |
KWAI CHUNG, HONG KONG |
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DAVID P. COOPER/KOLISCH HARTWELL, P.C. |
520 S.W. YAMHILL ST., SUITE 200 |
PORTLAND, OR 97204 |
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