Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/04/2015
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Application #:
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13922577
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Filing Dt:
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06/20/2013
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Publication #:
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Pub Dt:
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08/21/2014
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Inventor:
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Federico Giovanni Ziglioli
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Title:
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STACKED ASSEMBLY OF A MEMS INTEGRATED DEVICE HAVING A REDUCED THICKNESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| VIA OLIVETTI 2 |
| AGRATE BRIANZA, ITALY 20864 |
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| KAREN M. HENCKEL |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104-7092 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| 1228 PLAN-LES-OUATES |
| GENEVA, SWITZERLAND |
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| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE, SUITE 300 |
| COPPELL, TX 75019 |
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