Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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14271168
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Filing Dt:
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05/06/2014
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Publication #:
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Pub Dt:
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08/28/2014
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Inventors:
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Tao Feng, Ming Sun, FRANÇOIS HÉBERT, Yueh-Se Ho
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE AND PROCESS OF MANUFACTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CANNON'S COURT 22, VICTORIA STREET |
| HAMILTON, BERMUDA HM12 |
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| JOSHUA D. ISENBERG |
| JDI PATENT |
| 809 CORPORATE WAY |
| FREMONT, CA 94539 |
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