Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13777097
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Filing Dt:
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02/26/2013
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Publication #:
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Pub Dt:
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08/28/2014
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Inventor:
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Ying-Tung Wang
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Title:
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PACKAGING SUBSTRATE WITH CONDUCTIVE POSTS HAVING DIFFERENT WIDTHS THAN CONDUCTIVE BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE |
| TAOYUAN, TAIWAN |
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| EDWARDS WILDMAN PALMER LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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