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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14201892
Filing Dt:
03/09/2014
Publication #:
Pub Dt:
09/18/2014
Inventors:
Subhash Deshmukh, Jingjing Liu, He Ren
Title:
UV-ASSISTED REACTIVE ION ETCH FOR COPPER
Assignment: 1
Reel/Frame:
032556/0162Recorded: 03/30/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/18/2014
Exec Dt:
03/18/2014
Exec Dt:
03/18/2014
Assignee:
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
BRIAN M. DUGAN, DUGAN & DUGAN, PC
245 SAW MILL RIVER ROAD
SUITE 309
HAWTHORNE, NY 10532

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