Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/01/2016
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Application #:
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13836739
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Filing Dt:
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03/15/2013
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Publication #:
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Pub Dt:
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09/18/2014
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Inventors:
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MARK D. HOINKIS, Eric A. Joseph, Hiroyuki Miyazoe, Chun Yan
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Title:
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SPUTTER ETCH PROCESSING FOR HEAVY METAL PATTERNING IN INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| WALL & TONG, LLP IBM CORPORATION |
| 25 JAMES WAY |
| EATONTOWN, NJ 07724 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| KILPATRICK TOWNSEND & STOCKTON LLP / AMA |
| 1100 PEACHTREE STREET |
| SUITE 2800 |
| ATLANTA, GA 30309 |
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