Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13834061
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Filing Dt:
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03/15/2013
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Publication #:
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Pub Dt:
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09/18/2014
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Inventors:
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Chao-Yuan Huang, Yueh-Feng Ho, Ming-Sheng Yang, Hwi-Huang Chen
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Title:
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A Semiconductor Device with a Through-Silicon Via and a Method for Making the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 52, ZHIBO 3RD ST., XIANGSHAN DIST. |
| HSINCHU CITY 30092, TAIWAN |
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| KAMRATH IP LAWFIRM, P.A. |
| 4825 OLSON MEMORIAL HIGHWAY |
| SUITE 245 |
| GOLDEN VALLEY, MN 55422 |
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