Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14025612
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Filing Dt:
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09/12/2013
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Publication #:
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Pub Dt:
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09/18/2014
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Inventors:
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Hideharu KOBASHI, Keisuke NADAMOTO, Yoshihisa NAKAJIMA
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Title:
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DIE BONDER AND BONDING HEAD DEVICE OF THE SAME, AND ALSO COLLET POSITION ADJUSTING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6, MENUMA-NISHI 1-CHOME |
| KUMAGAYA-SHI, SAITAMA, JAPAN |
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| MCDERMOTT, WILL & EMORY |
| 500 NORTH CAPITOL STREET NW |
| WASHINGTON, DC 20001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 610-5, SHIMOIMASUWA |
| MINAMI-ALPS CITY |
| YAMANISHI, JAPAN 400-0212 |
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| TOMOKI TANIDA |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET NW |
| WASHINGTON, DC 20001 |
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