Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/03/2016
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Application #:
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14354647
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Filing Dt:
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04/28/2014
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Publication #:
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Pub Dt:
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10/09/2014
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Inventors:
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Pinxiang Duan, Elbertus Smalbrugge, Harmen Joseph Sebastiaan Dorren, Oded Raz
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Title:
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Wafer scale technique for interconnecting vertically stacked dies
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| DEN DOLECH 2 |
| EINDHOVEN, NETHERLANDS 5612 AZ |
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| RON JACOBS |
| 550 S. CALIFORNIA AVE. |
| SUITE 300 |
| PALO ALTO, CA 94306 |
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