Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14164893
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Filing Dt:
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01/27/2014
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Publication #:
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Pub Dt:
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10/09/2014
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Inventors:
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Ajay P. Malshe, Vishwas N. Bedekar, Ranjith John
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Title:
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METHOD OF FORMING REWORKABLE, THERMALLY CONDUCTIVE AND ELECTRICALLY RESISTIVE BONDING STRUCTURE IN SUPERCONDUCTOR MULTI-CHIP MODULE USING REWORKABLE EPOXY BONDING COMPOSITES AND APPLICATION OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2404 UNIVERSITY AVENUE |
| LITTLE ROCK, ARKANSAS 72207 |
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| MORRIS MANNING MARTIN LLP |
| 3343 PEACHTREE ROAD, NE |
| 1600 ATLANTA FINANCIAL CENTER |
| ATLANTA, GA 30326 |
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