Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/02/2015
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Application #:
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13937183
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Filing Dt:
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07/08/2013
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Publication #:
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Pub Dt:
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10/16/2014
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Inventors:
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Jing-Yi HUANG, Huey-Lin HSIEH, Tung-Han CHUANG, Jenn-Dong HWANG, Chao-Chi JAIN
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Title:
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MULTI-LAYER THERMOELECTRIC MODULE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 CHUNG KANG ROAD, HSIAO KANG |
| KAOHSIUNG, TAIWAN |
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| CKC & PARTNERS CO., LTD. |
| 12TH FLOOR, RUTTONJEE HOUSE 11 DUDDELL |
| STREET |
| HONG KONG, HONG KONG |
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