Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14059633
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Filing Dt:
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10/22/2013
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Publication #:
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Pub Dt:
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10/16/2014
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Inventors:
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CHEOL MIN PARK, In Youb Hwang
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Title:
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COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS AND METHOD OF PREPARING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| POONGSAN BLDG., 23 |
| CHUNGJEONG-RO, SEODAEMUN-GU |
| SEOUL 120-013, KOREA, REPUBLIC OF |
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| ANDREW F. YOUNG, ESQ. |
| LACKENBACH SIEGEL BUILDING |
| 1 CHASE ROAD |
| SCARSDALE, NY 10583 |
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