Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/03/2017
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Application #:
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14357046
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Filing Dt:
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05/08/2014
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Publication #:
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Pub Dt:
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10/16/2014
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Inventors:
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Hyung Won Kim, Yong Hee Han, Mi Sook Ahn
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Title:
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MEMS Sensor Packaging and Method Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 425 GYEONGGI R&DB CENTER, 906-5 IUI-DONG, YEONGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 443-270 |
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| THE WEBB LAW FIRM, P.C. |
| ONE GATEWAY CENTER |
| 420 FT. DUQUESNE BLVD, SUITE 1200 |
| PITTSBURGH, PA 15222 |
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