Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2018
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Application #:
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14146394
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Filing Dt:
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01/02/2014
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Publication #:
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Pub Dt:
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10/23/2014
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Inventors:
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Keum Hwan PARK, Suk Jun KIM, Jin Man PARK, Eun Sung LEE, Se Yun KIM, Do-hyang KIM et al
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Title:
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METALLIC GLASS, CONDUCTIVE PASTE, AND ELECTRONIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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129, SAMSUNG-RO, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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YONSEI UNIVERSITY, 134, SHINCHON-DONG, |
SEODAEMOON-GU |
SEOUL, KOREA, REPUBLIC OF 120-749 |
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HARNESS, DICKEY & PIERCE, P.L.C. |
P.O. BOX 8910 |
RESTON, VA 20195 |
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