Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/13/2018
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Application #:
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14329187
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Filing Dt:
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07/11/2014
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Publication #:
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Pub Dt:
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10/30/2014
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Inventors:
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Dirk M. Baars, Sankar J. Paul, Carlos L. Barton, Dale J. Doyle, Diana J. Williams
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Title:
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DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| IL1-1145/54/63, P.O. BOX 6026 |
| CHICAGO, ILLINOIS 60680-6026 |
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| GAYLE D. GROCKE C/O L&W |
| 330 N. WABASH AVENUE |
| SUITE 2800 |
| CHICAGO, IL 60611 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| IL1-1145/54/63, P.O. BOX 6026 |
| CHICAGO, ILLINOIS 60680-6026 |
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| ZEYNEP GIESEKE |
| 330 N. WABASH AVENUE, SUITE 2800 |
| LATHAM & WATKINS LLP |
| CHICAGO, IL 60611 |
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