Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/16/2015
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Application #:
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14364555
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Filing Dt:
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06/11/2014
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Publication #:
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Pub Dt:
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11/06/2014
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Inventors:
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Kohei Tatsumi, Takashi Yamada, Daizo Oda
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Title:
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POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND BONDING WIRE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 158-1 OOAZA SAYAMAGAHARA |
| IRUMA-SHI, SAITAMA, JAPAN 358-0032 |
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| 104 TOTSUKAMACHI 1-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN 169-8050 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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