Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14059167
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Filing Dt:
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10/21/2013
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Publication #:
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Pub Dt:
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11/06/2014
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Inventor:
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Tien-Ting Chen
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Title:
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LEAD-FREE SOLDER COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 508-51, SEC. 1, WENXIAN RD., RENDE DIST. |
| TAINAN CITY, TAIWAN 71755 |
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| LAURA A. CRUZ, ESQ. |
| CHRISTENSEN O'CONNOR JOHNSON KINDNESS |
| 1420 FIFTH AVENUE, SUITE 2800 |
| SEATTLE, WA 98101-2347 |
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