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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/06/2015
Application #:
14338754
Filing Dt:
07/23/2014
Publication #:
Pub Dt:
11/13/2014
Inventors:
Li Chen, Mitul Dalal
Title:
METHOD OF ETCHING A WAFER
Assignment: 1
Reel/Frame:
033375/0200Recorded: 07/23/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/20/2011
Exec Dt:
06/20/2011
Assignee:
ONE TECHNOLOGY WAY
NORWOOD, MASSACHUSETTS 02062-9106
Correspondent:
ROBERT M. ASHER
SUNSTEIN KANN MURPHY & TIMBERS LLP
125 SUMMER STREET
BOSTON, MA 02110-1618

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