Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/24/2017
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Application #:
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14359568
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Filing Dt:
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05/20/2014
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Publication #:
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Pub Dt:
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11/20/2014
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Inventors:
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Martin Schrems, Cathal Cassidy, Franz Schrank
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Title:
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SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER BALL AND RELATED METHOD OF PRODUCTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCHLOSS PREMSTAETTEN |
| TOBELBADER STR. 30 |
| UNTERPREMSTAETTEN, AUSTRIA 8141 |
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| JOHN D. MAGLUYAN |
| MCDERMOTT WILL & EMERY LLP |
| 4 PARK PLAZA, SUITE 1700 |
| IRVINE, CA 92614-2559 |
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