Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2016
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Application #:
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13899080
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Filing Dt:
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05/21/2013
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Publication #:
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Pub Dt:
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11/27/2014
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Inventor:
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David H. Eppes
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Title:
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VARIABLE TEMPERATURE SOLDERS FOR MULTI-CHIP MODULE PACKAGING AND REPACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE AMD PLACE, PO BOX 3453 |
| KEVIN A. O'NEIL |
| SUNNYVALE, CALIFORNIA 94088-3453 |
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| TIMOTHY M. HONEYCUTT |
| 37713 PARKWAY OAKS LN. |
| MAGNOLIA, TX 77355 |
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