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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/19/2016
Application #:
14287242
Filing Dt:
05/27/2014
Publication #:
Pub Dt:
12/04/2014
Inventors:
Akira SOEDA, Chiko YORITA, Shinichirou TOOYA, Takayuki ONO, Mitsuru TAKAHIRA et al
Title:
METHOD OF MANUFACTURING AN INTERLAYER CONNECTION SUBSTRATE
Assignment: 1
Reel/Frame:
032963/0025Recorded: 05/27/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/12/2014
Exec Dt:
03/24/2014
Exec Dt:
03/13/2014
Exec Dt:
03/13/2014
Exec Dt:
03/12/2014
Exec Dt:
03/13/2014
Exec Dt:
03/13/2014
Exec Dt:
03/17/2014
Exec Dt:
03/13/2014
Exec Dt:
03/15/2014
Assignee:
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 370
ALEXANDRIA, VA 22314

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